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INTEGRATED CIRCUITS
DATA SHEET
TZA1020; TZA1020A Pre-amplifiers for CD-RW systems
Product specification File under Integrated Circuits, IC01 2000 Oct 30
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 8.1.8 8.1.9 8.1.10 8.2 FEATURES GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Data amplifier Normalizer Wobble pre-processor Beta detector Alpha detector Fast track count Spot position measurement I2C-BUS PROTOCOL Addressing and data bytes Write mode Read mode Control byte subaddress 00 Control byte subaddress 01 Control byte subaddress 02 Control byte subaddress 03 Control byte subaddress 04 Control byte subaddress 05 Control byte subaddress 06 Control byte subaddress 07 Characteristics of the I2C-bus 9 10 11 11.1 11.2 11.3 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18
TZA1020; TZA1020A
LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS Transfer functions for normalized servo signals Laser power control signals (alpha circuit) Wobble pre-processor APPLICATION AND TEST INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS
2000 Oct 30
2
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
1 FEATURES
TZA1020; TZA1020A
* Data amplifier for read speed up to twelve times nominal data speed * Normalized and filtered error signals for servo control * Wobble pre-processor with switchable low-pass filter * Calculation of signals for real-time laser power control for write speed up to four times * Calculation of signals for optimum laser calibration for write speed up to four times * Fast track count amplifier * Spot position measurement for alignment of photo diodes * Reference voltage for laser controller * On-chip band gap and DACs for accurate and adjustable current/gain settings * I2C-bus microcontroller interface for programmable gain, speed switching and function selection * All functions available for CD-R and CD-RW systems. 3 QUICK REFERENCE DATA SYMBOL VDD VSS Ii(cd) B-3dB(norm) B-3dB(CAHF) td(g)(CAHF) GI(CAHF) IRREF Tamb 4 PARAMETER positive supply voltage negative supply voltage central diode input current range -3 dB bandwidth normalized error signals (servo) -3 dB bandwidth pin CAHF group delay variations pin CAHF current gain pin CAHF reference current ambient temperature Ci = 12 pF f = 0.1 to 12 MHz; Ci = 12 pF cdrwsel = 1 cdrwsel = 0 CONDITIONS MIN. 4.5 -5.5 0 48 17 - - - - 0 TYP. 5.0 -5.0 - 60 - - 35 8.75 -900 - MAX. 5.5 -4.5 4000 - - 0.9 - - - 70 A C UNIT V V A kHz MHz ns 2 GENERAL DESCRIPTION
TZA1020 (AEGER2) is an analog pre-processor IC for CD-R and CD-RW systems with 3-spots push-pull tracking system. The IC interfaces directly to the photo diodes. The device generates signals for laser power calibration and laser power control during disc writing. Normalized error signals are generated for servo control and wobble detection. An HF current amplifier is implemented to detect the actual HF data signal. The Fast Track Count (FTC) amplifier generates a radial error signal to allow fast track counting. TZA1020A (AEGER2A) is similar to the TZA1020, except for non-clamped MIRN, which allows operation with IGUANA.
ORDERING INFORMATION TYPE NUMBER PACKAGE NAME QFP44 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm VERSION SOT307-2
TZA1020HP; TZA1020HP/A
2000 Oct 30
3
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
5 BLOCK DIAGRAM
TZA1020; TZA1020A
handbook, full pagewidth
ERON
15 35 FEN REN TLN XDN MIRN
CAGAIN
11
INPUT STAGE 3 LPF 1 DIODE INPUT STAGE 1 LPF 2 WOBBLE PREPROCESSOR NORMALIZER
36 37 34 38
SA1 SA2 SB1 SB2 C1 C2 C3 C4 AMON
4 8 5 9 10 3 6 7 14 DIODE INPUT STAGE 2
27 26
CWBL PPN
22 21 20 ALPHA DETECTOR 19 24
AINT ALS AINTON ASTROBE DALPHA AZIN
TZA1020 TZA1020A
control switches control currents CURRENT AMPLIFIER
25
23
CAHF
REGISTER 12 13 I2C-BUS INTERFACE DACs UOUT 1 DRIVER POR BETA DETECTOR
44 43
CALF A1 A2 CALPF HCA1 HCA2
SDA SCL
42 39 40 41
32 2 BAND GAP REFERENCE MEAS 33
MEAS1 MEAS2
RREF
FAST TRACK COUNT 28 16 30 18 29 17
31
RE
MGR809
VDD1 VDD2 VSS1 VSS2 GND1 GND2
Fig.1 Block diagram.
2000 Oct 30
4
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
6 PINNING SYMBOL UOUT RREF C2 SA1 SB1 C3 C4 SA2 SB2 C1 CAGAIN SDA SCL AMON ERON VDD2 GND2 VSS2 ASTROBE AINTON ALS AINT CAHF DALPHA AZIN PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 DESCRIPTION reference voltage output reference current input central photo diode current input satellite photo diode current input satellite photo diode current input central photo diode current input central photo diode current input satellite photo diode current input satellite photo diode current input central photo diode current input set-point laser power on disc, current input I2C-bus data input/output I2C-bus clock input alpha measurement on switch (write/read state) normalized error signals on switch positive supply voltage 2 ground 2 negative supply voltage 2 control signal sample-and-hold in alpha measurement control signal integrator in alpha measurement DALPHA output enabled/disabled integrator capacitor for alpha measurement central aperture high-frequency current output alpha error signal for laser power control set-point alpha control MIRN CALPF HCA1 HCA2 A2 A1 CALF 38 39 40 41 42 43 44 TLN 37 FEN REN 35 36 MEAS2 XDN 33 34 VDD1 GND1 VSS1 RE MEAS1 28 29 30 31 32 CWBL 27 SYMBOL PPN PIN 26
TZA1020; TZA1020A
DESCRIPTION normalized, balanced push-pull signal voltage capacitor for EFM noise reduction loop positive supply voltage 1 ground 1 negative supply voltage 1 fast track count signal voltage output combination of photo diode currents for adjustment 1 combination of photo diode currents for adjustment 2 normalized spot position error current output normalized focus error current output normalized radial error current output normalized track-loss current output mirror output (disc reflection) current output capacitor to define CALF bandwidth capacitor to define time constant peak detector A1 capacitor to define time constant peak detector A2 pit amplitude relative to CALF, voltage output land amplitude relative to CALF, voltage output low-pass filtered aperture signal, voltage output
2000 Oct 30
5
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
41 HCA2
40 HCA1
38 MIRN
44 CALF
handbook, full pagewidth
39 CALPF
34 XDN
36 REN
35 FEN
37 TLN
42 A2
43 A1
UOUT 1 RREF 2 C2 3 SA1 4 SB1 5 C3 6 C4 7 SA2 8 SB2 9 C1 10 CAGAIN 11
33 MEAS2 32 MEAS1 31 RE 30 VSS1 29 GND1
TZA1020HP TZA1020HP/A
28 VDD1 27 CWBL 26 PPN 25 AZIN 24 DALPHA 23 CAHF
ALS 21
AMON 14
ERON 15
VDD2 16
GND2 17
VSS2 18
ASTROBE 19
AINTON 20
AINT 22
SDA 12
SCL 13
MGR810
Fig.2 Pin configuration.
handbook, halfpage
A
C1 SA1 SA2 C4
C
C2
B
SB1 SB2 C3
S1
S2
MGR811
Fig.3 Quadrant diode configuration.
2000 Oct 30
6
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
7 FUNCTIONAL DESCRIPTION 7.4 Beta detector
TZA1020; TZA1020A
All functions are designed in such a way that a read speed up to twelve times nominal speed is possible (N = 1, 2, 4, 8 or 12). Recording speed up to four is possible (N = 1, 2 or 4). The maximum recording speed must be determined. 7.1 Data amplifier
The central diodes currents (C1 to C4) are fed to a high bandwidth current amplifier. The gain of the current amplifier can be switched by means of the I2C-bus microcontroller interface to compensate for differences in CD-R and CD-RW disc reflection. Data signals up to twelve times nominal data speed can be read. 7.2 Normalizer
The beta detector generates signals necessary for the symmetry detection of the HF signal. By measuring peak values (A1 and A2) and average value of the signal (CALF), an optimum laser writing power can be determined. The gain of the measured values is controlled by the I2C-bus. The time constant of the peak detectors and bandwidth of the low-pass filtered aperture signal can also be adapted to the disc speed by the I2C-bus. 7.5 Alpha detector
The currents from the central diodes (C1 to C4), the current from the satellite diodes (SA1, SA2, SB1 and SB2) and the laser set-point current (CAGAIN) are (optionally sampled) fed to the first low-pass filters with a bandwidth of 60 kHz. The normalizing circuit generates error signals for servo control that are independent of the diode current level. The gain of the error signals is controlled by the I2C-bus microcontroller interface. A dropout concealment becomes active if the input current level is below a certain threshold value. This threshold value is also controlled by the I2C-bus. 7.3 Wobble pre-processor
The alpha detector determines a parameter called `alpha' during disc writing. Alpha must be kept constant to allow recording over a fingerprint or black dot. The definition of alpha is different for CD-R and CD-RW; for CD-R the light absorption of the disc is measured, for CD-RW alpha is determined by actual laser power and disc reflection. The gain of the measured signals and the CD-R and CD-RW selection is performed by the I2C-bus. 7.6 Fast track count
The fast track count circuit generates a Radial Error (RE) signal for fast track counting. A gain switch compensates for difference in CD-R and CD-RW disc reflection. 7.7 Spot position measurement
The wobble signal of the pre-groove is detected by means of the PPN signal. The currents from inputs C1 to C4 are filtered and processed to provide optimal signal-to-noise ratio. The bandwidth of the filter may be adapted to the disc speed via the I2C-bus. The bandwidth of a noise reduction loop is controlled by an external capacitor, the I2C-bus interface controls the total operation of the processor.
To allow alignment of photo diodes via the TZA1020, a number of linear combinations of input currents can be realized (MEAS1 and MEAS2). Selection of the actual combination is performed by the I2C-bus.
2000 Oct 30
7
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8 8.1 I2C-BUS PROTOCOL Addressing and data bytes
TZA1020; TZA1020A
Full control of the TZA1020 is accomplished via the 2-wire I2C-bus. Up to 400 kbits/s bus speed can be used in accordance with the I2C-bus fast-mode specification. For programming the device (write mode) eight data byte registers are available/addressable via eight subaddresses. Automatic subaddress incrementing enables the writing of successive data bytes in one transmission. During power-on, data byte registers are reset to a default state by use of a Power-On Reset (POR) circuit whose signal is derived from the internally generated I2C-bus supply voltage (VSS1). For reading from the device (read mode) one data byte register is available without subaddressing. 8.1.1 Table 1 WRITE MODE Slave address; 34H 0 0 1 1 0 1 0 0
Slave address Table 2
Subaddress 00H to 07H 0(1) 0(1) 0(1) 0(1) 0 0/1 0/1 0/1
Subaddress Note
1. The use of subaddresses F0H to F7H (11110XXX) instead of 00H to 07H (00000XXX) disables the automatic subaddress incrementing allowing continuous writing to a single data byte register (e.g. DAC testing). Table 3 SUB ADDR 00H 01H 02H 03H 04H 05H 06H 07H 8.1.2 Table 4 Overview of subaddresses POR STATE 00000000 00000000 00000000 00000000 00011111 01100000 00000000 READ MODE Slave address; 35H 0 0 1 1 0 1 0 1 free tlngain1 tmdac sdfine7 lexton free porr algctr6 tlngain0 tlnlim1 sdfine6 betactrl1 ppnctrl1 free algctr5 rengain tlnlim0 sdfine5 betactrl0 ppnctrl0 urefsel DATA BYTES
00000000 alphactr2 alphactr1 alphactr0 alphagain4 alphagain3 alphagain2 alphagain1 alphagain0 algctr4 negain4 sumref4 sdfine4 betascl4 ppnscl4 cdrwsel algct3 negain3 sumref3 sdfine3 betascl3 ppnscl3 lpsel1 algctr2 negain2 sumref2 sdfine2 betascl2 ppnscl2 lpsel0 algctr1 negain1 sumref1 sdfine1 betascl1 ppnscl1 meassel1 algctr0 negain0 sumref0 sdfine0 betascl0 ppnscl0 meassel0
Slave address Table 5 Read byte
Read byte Notes
por(1)
0(2)
0(2)
0(2)
0(2)
0(2)
0(2)
0(2)
1. In read mode the actual POR status can be read. 2. The state of unused read bits should not be relied upon; their state may be changed during development.
2000 Oct 30
8
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8.1.2.1 Examples of valid transmissions to and from the TZA1020
TZA1020; TZA1020A
Write: START - 34H - 00H - Data_for_00 - STOP Write with auto-increment: START - 34H - 00H - data_for_00 - data_for_01 - data_for_02 - STOP Auto-increment `wrap around': START - 34H - 07H - data_for_07 - data_for_00 - data_for_01 - STOP Write without auto-increment: START - 34H - F5H - data_for_05 - data_for_05 - data_for_05 - STOP Read: START - 35H - data_from_ IC - STOP. 8.1.3 Table 6 CONTROL BYTE SUBADDRESS 00 Control bits for alphactrl alphactrl2 0 0 0 0 1 1 1 1 Table 7 alphactrl1 0 0 1 1 0 0 1 1 alphactrl0 0 1 0 1 0 1 0 1 GAIN INPUT CURRENT ALPHA DETECTOR 0.50 0.33 0.25 0.20 0.17 0.14 0.12 0.11
Control bits for alphagain-DAC; note 1 alphagain3 0 0 0 alphagain2 0 0 0 : code alphagain1 0 0 1 alphagain0 0 1 0 CURRENT alphagain-DAC 3.125 A 6.250 A 9.375 A : 100 A (code + 1)/32 0 1 1 1 0 1 93.750 A 96.900 A 100 A
alphagain4 0 0 0
1 1 1 Note
1 1 1
1 1 1
1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A.
2000 Oct 30
9
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8.1.4 Table 8 algctr6 0 0 0 1 1 - - - - - - - - - - 8.1.5 Table 9 CONTROL BYTE SUBADDRESS 01 Control byte for algctrl switch functions algctr5 0 - - - - 0 1 - - - - - - - - algctr4 0 0 1 0 1 - - - - - - - - - - algctr3 0 - - - - - - 0 1 - - - - - - algctr2 0 - - - - - - - - 0 1 - - - - algctr1 0 - - - - - - - - - - 0 0 1 1 algctr0 0 - - - - - - - - - - 0 1 0 1
TZA1020; TZA1020A
DESCRIPTION POR state current gain alpha CD-R Aoc = 0alpha CD-R circuit power-off current gain alpha CD-R Aoc = 1alpha CD-R circuit power-on current gain alpha CD-R Aoc = 3alpha CD-R circuit power-off current gain alpha CD-R Aoc = 4alpha CD-R circuit power-on alpha peak detector normal mode alpha peak detector to level (test) CD-RW mode 1 CD-RW mode 2 alpha CD-R alpha CD-RW DALPHA gain = 0.25 DALPHA gain = 0.50 DALPHA gain = 0.75 DALPHA gain = 1.00
CONTROL BYTE SUBADDRESS 02 Control bits for tlngain tlngain1 0 0 1 1 tlngain0 0 1 0 1 GAIN TLN SIGNAL 1.5 3.0 4.5 6.0
Table 10 Control bits for rengain rengain 0 1 DESCRIPTION 1 normal 1.3 self test
2000 Oct 30
10
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
Table 11 Control bits for current negain-DAC; note 1 negain4 0 0 0 negain3 0 0 0 negain2 0 0 0 : code 1 1 1 Note 1 1 1 1 1 1 0 1 1 1 0 1 negain1 0 0 1 negain0 0 1 0
TZA1020; TZA1020A
CURRENT negain-DAC 3.125 A 6.250 A 9.375 A : 100 A (code + 1)/32 93.750 A 96.900 A 100 A
1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A. 8.1.6 CONTROL BYTE SUBADDRESS 03
Table 12 Control bit for tmdac tmdac 0 1 Table 13 Control bits for tlnlimit tlnlim1 0 X 1 tlnlim0 0 1 0 clamp off clamp on 1 (0.6 V; Tamb = 25C) clamp on 2 (1.2 V; Tamb = 25C) DESCRIPTION DESCRIPTION DAC test off DAC test on
Table 14 Control bits for current sumref-DAC; note 1 sumref4 0 0 0 sumref3 0 0 0 sumref2 0 0 0 : code 1 1 1 Note 1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A. 1 1 1 1 1 1 0 1 1 1 0 1 sumref1 0 0 1 sumref0 0 1 0 CURRENT sumref-DAC 0.468 A 0.937 A 1.40 A : 15 A (code + 1)/32 14.06 A 14.53 A 15.00 A
2000 Oct 30
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Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8.1.7 CONTROL BYTE SUBADDRESS 04
TZA1020; TZA1020A
Table 15 Control byte for 8-bit sdfine-DAC; note 1 sdfine7 sdfine6 sdfine5 sdfine4 sdfine3 sdfine2 sdfine1 sdfine0 0 0 0 0 0 0 0 0 0 0 0 0 : code 1 1 1 Note 1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A. 8.1.8 CONTROL BYTE SUBADDRESS 05 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1 0 1 0 0 0 0 0 0 0 0 1 0 1 0 CURRENT sdfine-DAC 0.117 A 0.234 A 0.352 A : 30 A (code + 1)/256 29.76 A 29.88 A 30.0 A
Table 16 Control bits for betactrl control via 5-bit DAC betactrl1 0 0 1 1 betactrl0 0 1 0 1 CALF BANDWIDTH (Hz) 500 1000 2000 4000
Table 17 Control bits for betascl control via 5-bit DAC; note 1 betascl4 0 0 0 betascl3 0 0 0 betascl2 0 0 0 : code 1 1 1 Note 1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A. 1 1 1 1 1 1 0 1 1 1 0 1 betascl1 0 0 1 betascl0 0 1 0 CURRENT betascl-DAC 3.125 A 6.250 A 9.375 A : 100 A (code + 1)/32 93.750 A 96.900 A 100 A
2000 Oct 30
12
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8.1.9 CONTROL BYTE SUBADDRESS 06
TZA1020; TZA1020A
Table 18 Control bits for ppnctrl control via 5-bit DAC ppnctrl1 1 - - 0 1 ppnctrl0 1 0 1 - - POR state integrator slow disabled integrator slow enabled integrator fast disabled integrator fast enabled DESCRIPTION
Table 19 Control bits for ppnscl control via 5-bit DAC; note 1 ppnscl4 0 0 0 ppnscl3 0 0 0 ppnscl2 0 0 0 : code 1 1 1 Note 1. The currents of all DACs is controlled by reference current (IRREF). The given currents are valid at IRREF = -900 A. 8.1.10 CONTROL BYTE SUBADDRESS 07 1 1 1 1 1 1 0 1 1 1 0 1 ppnscl1 0 0 1 ppnscl0 0 1 0 CURRENT ppnscl-DAC 3.125 A 6.250 A 9.375 A : 100 (code + 1)/32 93.750 A 96.900 A 100 A
Table 20 Control bits for porr porr 0 1 Note 1. When porr is set to logic 1 it ensures that the POR read bit is reset to logic 0. This way a reading of POR is always at logic 1 with the occurrence of an actual power-on I2C-bus register reset and cannot accidentally be caused by other I2C-bus control bits. Bit porr has no control function; it is an `unused' bit dedicated by name to change the I2C-bus register content from the POR state. Bit POR of the read byte is a wired NOR function that checks all I2C-bus register bits: when the I2C-bus register contents equals the Power-on reset default state POR will read logic 1, also when this state is set via the I2C-bus control. Because a setting of porr = 1 differs from the POR default state it forces a reset to logic 0 of the POR bit independent of other bit settings. MODE note 1 POR reset reset of POR signal bit DESCRIPTION
2000 Oct 30
13
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
Table 21 Control bits for meassel meassel1 0 0 1 1 Table 22 Control bits for lpsel lpsel1 0 0 1 1 Table 23 Control bit for cdrwsel cdrwsel 0 1 Table 24 Control bits for urefsel urefsel 0 1 Table 25 Read byte POR 0 1 Note I2C-bus lpsel0 0 1 0 1 meassel0 0 1 0 1 MEAS1 Gs (Ia1 - Ia2) Gs (Ia1 + Ib1) Gs (Ia1 + Ia2)
TZA1020; TZA1020A
MEAS2 Gs (Ib2 - Ib1) Gs (Ia2 + Ib2) Gs (Ib2 + Ib1)
Gc [(Ic1 + Ic4) - (Ic2 + Ic3)] Gc [(Ic1 + Ic2) - (Ic3 + Ic4)]
BANDWIDTH 40 kHz 80 kHz 160 kHz 320 kHz
DESCRIPTION CD-R mode CD-RW mode
REFERENCE OUTPUT VOLTAGE 2.9 V 3.5 V
DESCRIPTION bit state differs from power-on reset state I2C-bus bit state equals power-on reset state; note 1
1. At power-on, an internal power-on reset signal is generated which resets the I2C-bus data bits to a pre-defined state. When the internal data bits are found to be in a POR state (due to an actual power-on reset but also when set via the I2C-bus) bit POR signals logic 1. Using the POR bit to detect occurrence of a power-on reset requires bit PORR to be set to logic 1 after power-up. Setting bit PORR forces the POR bit to logic 0 independent of other I2C-bus bit settings.
2000 Oct 30
14
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
8.2 Characteristics of the I2C-bus
TZA1020; TZA1020A
FAST-MODE I2C-BUS SYMBOL fSCL tBUF tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tr tf tSU;STO Cb Note 1. Cb = total capacitance of one bus line in pF. For more information on "The I2C-bus and how to use it" see home page http://www.semiconductors.philips.com. PARAMETER MIN. SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition; after this period, the first clock pulses are generated LOW period of the SCL clock HIGH period of the SCL clock set-up time for a repeated START condition data hold time data set-up time rise time of both SDA and SCL signals fall time of both SDA and SCL signals set-up time for STOP condition capacitive load for each bus line; note 1 0 1.3 0.6 1.3 0.6 0.6 0 100 20 + 20 + 0.6 - 0.1Cb(1) 0.1Cb(1) 400 - - - - - 0.9 - 300 300 - 400 MAX. kHz s s s s s s ns ns ns s pF UNIT
2000 Oct 30
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SDA t BUF t LOW tr tf t HD;STA t SP SCL t HD;STA P S t HD;DAT t HIGH t SU;DAT t SU;STA t SU;STO Sr
MBC611
Philips Semiconductors
Pre-amplifiers for CD-RW systems
handbook, full pagewidth
16
P
TZA1020; TZA1020A
Product specification
Fig.4 Definition of timing on the I2C-bus.
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
Table 26 Scale factors controlled by the I2C-bus interface SCALE FACTOR REscale TLscale CONTROL SIGNAL rengain tlngain1 and tlngain0
TZA1020; TZA1020A
BINARY VALUE CONTROL SIGNAL 0 1 00 01 10 11
VALUE SCALE FACTOR 1 1.3 1.5 3.0 4.5 6.0 0.05 0.2
MIRscale
cdrwsel
0 1
Table 27 Currents controlled by the I2C-bus interface; note 1 NORMALIZER CURRENTS Inegain CONTROL SIGNAL negain4 to negain0 BINARY VALUE CONTROL SIGNAL 00000 : 01111 : 11111 Isumref sumref4 to sumref0 00000 : 01111 : 11111 Isdfine sdfine7 to sdfine0 0000000 : 0111111 : 1111111 Iref Note 1. The currents are proportional to IRREF. The given current values are valid at IRREF = -900 A. - - VALUE CURRENT (A) 3.125 : 50 : 100 0.47 : 7.5 : 15 0.12 : 15 : 30 20
2000 Oct 30
17
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Tstg Tamb Ves positive supply voltage storage temperature ambient temperature electrostatic handling voltage: Machine model Human body model 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air PARAMETER
TZA1020; TZA1020A
MIN. 0 -65 0 -200 -1000
MAX. 13.2 +150 70 +200 +1000 V
UNIT C C V V
VALUE 60
UNIT K/W
11 CHARACTERISTICS VDD1 = VDD2 = 5 V; VSS1 = VSS2 = -5 V; Tamb = 25 C; ERON = 1; AMON = 0; IRREF = -900 A; unless otherwise specified. SYMBOL Supplies VDD1 VSS1 VDD2 VSS2 VDD VSS IDD(tot) positive supply voltage 1 (pin 28) negative supply voltage 1 (pin 30) positive supply voltage 2 (pin 16) negative supply voltage 2 (pin 18) difference between VDD1 and VDD2 difference between VSS1 and VSS2 positive supply current VDD1 + VDD2 quiescent state maximum current maximum current at AMON = 1 ISS(tot) negative supply current VSS1 + VSS2 quiescent state maximum current maximum current at AMON = 1 4.5 -5.5 4.5 -5.5 -0.5 -0.5 - - - - - - 5.0 -5.0 5.0 -5.0 - - 12 26 49 16 25 33 5.5 -4.5 5.5 -4.5 +0.5 +0.5 - - - - - - V V V V V V mA mA mA mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2000 Oct 30
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Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL
PARAMETER
CONDITIONS -
MIN.
TYP. -900 - 1.245 -
MAX.
UNIT A A V
Reference input current; pin RREF Ii(RREF) IRREF Vi(RREF) input reference current current range input voltage on pin RREF IRREF = -900 A referenced to VSS urefsel = 0 IUOUT = -6 mA IUOUT = 0 mA HIGH-level output reference voltage urefsel = 1 IUOUT = -6 mA IUOUT = 0 mA IUOUT CUOUT Detector inputs INPUT CURRENT RANGE Ii(Cn) Ii(SA,SB) Ii(CAGAIN) central diode input current for C1 to C4 AMON = 0 AMON = 1 1.0 0 0.6 0 30 - - - - - 75 4000 9 520 1800 A A A A A current range capacitance on pin UOUT (necessary for stability) IUOUT = -6 mA IUOUT = 0 mA 3.23 - -10 22 100 3.4 3.5 - - - 3.57 - 0 - - V V mA nF nF 2.63 - 2.77 2.9 2.90 - V V note 1 -1200 1.22 -6500 1.26
Reference voltage buffer; pin UOUT VUOUT LOW-level output reference voltage
satellite diode input current AMON = 0 for SA1/SA2 and SB1/SB2 AMON = 1 input current for set-point laser power
INPUT VOLTAGE LEVEL Vi(Cn) Vi(SA,SB) Vi(CAGAIN) INPUT RESISTANCE Ri(Cn) central diode input resistance for C1 to C4 AMON = 0 AMON = 1; Ii(cd) = 25 A Iexton = 1 Iexton = 0 Ri(SA,SB) satellite diode input resistance for SA1/SA2 and SB1/SB2 input resistance for set-point laser power Ii(SA,SB) = 6.25 A Iexton = 1 Iexton = 0 Ii(CAGAIN) = 35 A - - - 1000 4000 700 - - - - - 600 1000 - - - 300 - central diode input voltage for C1 to C4 AMON = 0 AMON = 1 - - - - - 0 1.4 1.4 1.4 0.7 - - - - - V V V V V
satellite diode input voltage AMON = 0 for SA1/SA2 and SB1/SB2 AMON = 1 input current for set-point laser power
Ri(CAGAIN)
2000 Oct 30
19
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL Digital control signals
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
INPUT VOLTAGE LEVELS; PINS ERON, ASTROBE, AINTON, ALS, SDA, SCL AND AMON VIL VIH VOH VOL INPUT CURRENT ILI input leakage current pins SDA, SCL, AMON and ALS pin ERON pins AINTON and ASTROBE DELAY TIMES td delay time pins ASTROBE and AINTON pins SDA, SCL, AMON and ALS pin ERON Normalized servo signals; note 2 and Section 11.1 GAIN SETTINGS Gfe Gre Gtl Gxd Ggr Gmir gain focus error signal gain radial error signal gain track loss signal gain radial beam landing gain in grating ratio correction gain in mirror signal ERON = 1 ERON = 0 ERON = 1 ERON = 0 ERON = 1 ERON = 0 ERON = 1 ERON = 0 ERON = 1 ERON = 1 0.22 - 0.87 - 0.87 - 0.87 - 0.94 0.90 0.24 0 0.95 0 0.95 0 0.95 0 1 1.03 0.26 - 1.03 - 1.03 - 1.03 - 1.06 1.15 - - - 15 36 2.5 - 50 3.5 ns ns ns -1.5 -15 -100 - - 0 0 0 +100 A A nA LOW-level input voltage HIGH-level input voltage VDD1 = VDD2 = 5.0 V VDD1 = VDD2 = 5.0 V VDD1 = 5.0 V -0.3 2.3 - - - - +0.9 5.3 V V
OUTPUT VOLTAGE LEVEL; PIN SDA LOW-level output voltage HIGH-level output voltage 4.5 0 5.0 0.5 V V
2000 Oct 30
20
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL OFFSET CURRENTS Ioffset(fe) Ioffset(re) Ioffset(tl) Ioffset(xd) Ioffset(re) Ioffset(tl)
PARAMETER
CONDITIONS
MIN. -550
TYP.
MAX.
UNIT
offset current focus error offset current radial error offset current track loss offset radial beam landing variation in offset current radial error variation in offset current track loss AMON 0 1 AMON 0 1 rengain = 0 tlngain(1,0) = 00
0 0 0 0 0 -0.2
+550 +1.5 +4 +1.5 +0.8 +1.2
nA A A A A A
-1.5 -4 -1.5 -0.8 -1.4
OUTPUT IMPEDANCE Zo(FEN) Zo(REN) Zo(XDN) Zo(TLN) Zo(MIRN) output impedance pin FEN output impedance pin REN output impedance pin XDN output impedance pin TLN output impedance pin MIRN - - - - - 40 21 21 15 80 - - - - - M M M M M
VOLTAGE RANGE OF OUTPUT SIGNALS Vo(FEN) Vo(REN) Vo(XDN) Vo(l)(TLN) output voltage pin FEN output voltage pin REN output voltage pin XDN output voltage pin TLN tlnlim(1,0) = 00; note 3 tlnlim(1,0) = X1; note 3 tlnlim(1,0) = 10; note 3 Vo(l)(MIRN) Vo(l)(MIRN) BANDWIDTH B-3dB B-3dB -3 dB bandwidth relative variation of B-3 dB over total input current range 48 - 60 - 72 4 kHz % output voltage linear range pin MIRN; TZA1020 output voltage linear range pin MIRN; TZA1020A note 4 note 4 -4 -4 -4 -4 -1 -2 0.2 0.2 - - - - - - - - +4 +4 +4 +3 +1 +2 1.0 4.0 V V V V V V V V
Fast track count; see Table 28 and notes 5 and 6 GAIN SETTINGS Ztr(FTC) transimpedance of fast track circuit cdrwsel = 0 cdrwsel = 1 AMON = 1 Ggr VRE-NOM(p-p) gain in grating ratio correction nominal signal swing (peak-to-peak value) 4 16 - 0.94 - 5 20 0 1.00 1 6 24 - 1.06 - V k k k
2000 Oct 30
21
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL TSZtr(FTC)
PARAMETER temperature sensitivity for transimpedance of fast track circuit
CONDITIONS -
MIN.
TYP. 0.2 -
MAX.
UNIT %/K
FAST TRACK COUNT SIGNAL VOLTAGE OUTPUT; PIN RE Vo(RE) Voffset(RE) Ro(RE) B-3dB(RE) output voltage range output offset voltage output resistance bandwidth of RE signal cdrwsel = 0 cdrwsel = 1 minimum diode currents CL = 20 pF; valid for complete input current range -3.5 -40 -100 - - 800 - 0 +25 125 580 - +2.5 +40 +150 - - - V mV mV kHz
Spot position measurements; see Table 29 and note 7 GAIN SETTINGS Gcd Gsd gain central diode current combination gain satellite diode current combinations AMON = 0 AMON = 1 AMON = 0 AMON = 1 0.45 - 0.9 - -1.6 -1.6 -1.6 -1.6 7.5 0.50 0 1.00 0 0.55 - 1.1 - +1.6 +1.6 +1.6 +1.6 A A A A
OFFSET CURRENTS Ioffset(MEAS) offset of MEAS1 current offset of MEAS2 current Central aperture high frequency output GI(CAHF) current gain cdrwsel = 0; ICI = 180 A cdrwsel = 0; IC1 = 0 A Ci = 12 pF; note 8 Ci = 5 pF f = 0.1 to 12 MHz Ci = 12 pF Ci = 5 pF - - - - 0.9 1.1 ns ns 8.25 35 100 - - - - 9.0 38 A MHz MHz meassel = 00 meassel = 01 meassel = 00 meassel = 01 0 0 0 0
cdrwsel = 1; IC1 = 50 A 30 Ioffset(CAHF) f-3dB td offset current at zero input current bandwidth (-3 dB), valid for total current range delay variations valid for total current range - 17 19
2000 Oct 30
22
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Laser power calibration signals (beta circuit); see Fig.5 and Table 30 Ip1 = Ip2 = 10 TO 90 A; 2.1 x Ip1; Ibetascl = Ip1 Vref(beta) VA1/VA2 VA1/VCALF reference voltage for beta detector ratio between A1 and A2 ratio between CALF and A1 AMON = 0 AMON = 1 1.1 - 0.9 0.8 1.25 0 1 1 1.4 - 1.1 1.2 V V - -
Ic1 = 100 A; Ibetascale = Ip1 B-3dB bandwidth (-3 dB) of CALF CCALPF = 15 nF and CALFI signal betactrl = 00 betactrl = 01 betactrl = 10 betactrl = 11 tcpeak time constant peak detector CHCA1 = CHCA2 = 10 nF betactrl = 00 betactrl = 01 betactrl = 10 betactrl = 11 Ro Vo output resistance pins A1, A2 and CALF output voltage pins A1, A2 and CALF VDD1 = 5.0 V - - - - - 0 500 250 125 60 250 - - - - - - 4.5 s s s s V - - - - 500 1000 2000 4000 - - - - Hz Hz Hz Hz
Laser power calibration signals (alpha circuit); see note 9 and Tables 31 and 32 GAIN SETTINGS Galpha(CD-RW) GCD-R(i) GCD-R(norm) Gsub VAINT-ASTROBE gain in alpha CD-RW circuit gain in CD-R input circuit gain in CD-R normalizer subtractor gain change in voltage measured behind ASTROBE switch voltage range pin AINT bandwidth of low-pass filter ERON = 1 current to peak detector leakage current of peak detector time constant peak detector time discrete to time continues algctr6 = 1; algctr4 = 0 switching AINTON at realistic data speed = N ERON = 1 ERON = 0 AINTON = 1 ASTROBE = 1 ALS = 1 ALS = 0 ASTROBE 1 0 0.88 - 0.53 38126 0.94 - - 1 0 0.62 48158 0.97 0 130 1.12 - 0.72 6190 1.0 - - mV A/V
VAINT Blpf Ipeak IL(peak) tcpeak
0.5 48 0.3 - -
- 60 - 100 5/N
3 72 2 - -
V kHz mA A/s s
2000 Oct 30
23
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL VAZIN Vo(DALPHA) Rsw(AINTON)
PARAMETER
CONDITIONS - - IAZIN = 10 A
MIN. 0
TYP. - - -60 - 50
MAX.
UNIT mV mV V
voltage on AZIN input node IAZIN = 100 A output voltage pin DALPHA resistance AINTON switch
-3.5 -
+3.5 -
Wobble pre-processor; see note 10 and Table 33 LPF2 B-3dB(LPF2) bandwidth (-3 dB) of LPF2 lpsel = 00 lpsel = 01 lpsel = 10 lpsel = 11 BLPF2 relative variation BLPF2 over input current range note 10 32 64 120 240 - 40 80 150 300 - 48 96 180 360 6 kHz kHz kHz kHz %
VARIABLE GAIN LOOP kbal Gbal Il/Ir SRloop B-3dB(bal) MULTIPLIER LOOP VPPN(norm) Rca B-3dB(HPF) kmult gm(V-I) normalize voltage pin PPN resistance ca bandwidth (-3 dB) of HPF sensitivity multiplier transconductance V I Vp - Vref(V-I) < 0.354 V; note 12 ppnctrl2 = 0 Vref(V-I) reference voltage V I AMON = 0 AMON = 1 - - - 40 - - - 3.25 3.14 8 - 50 0.19 340 0 3.5 - - 1 60 - - - 3.75 V k k kHz mA/V2 A/V A/V V sensitivity balance circuit gain balancing circuit input current range of balancing circuit slew rate loop bandwidth variable gain loop ppnctrl1 = 0 Iop = Ion = 0 A; note 11 ppnctrl1 = 0; note 11 cdrwsel = 0 cdrwsel = 1 - 0.758 3.0 0.5 - - 800 - 1 0.889 3.5 - 6200 0 1000 0 - 0.951 3.84 2 - - 1250 - V/s V/s kHz kHz V-1
2000 Oct 30
24
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
SYMBOL OUTPUT STAGE; note 13 VPPN R(I-V) Voffset(PPN)
PARAMETER
CONDITIONS
MIN. -3.5 244 -
TYP.
MAX.
UNIT
voltage range I -> V conversion resistance offset voltage of PPN signal Ippnscl = 3.125 A Ippnscl = 100 A ppnctrl1 = 0 Ippnscl = 3.125 A Ippnscl = 100 A
+2.5 400 +50 +1325 +130 +4000 - - -
V k mV mV mV mV %/C
320 +6 +80 +6 +80 2200 400 0.2
-38 -1165 -115 -3800 - - -
Ro(PPN) TSR(I-V)
output resistance PPN signal temperature sensitivity of offset voltage of PPN signal internal signal bandwidth of PPN circuit
Ippnscl = 3.125 A Ippnscl = 20 A
B-3dB(PPN) Notes
-
1
-
MHz
1. In the application, the reference current will be generated by means of a resistor. The given current can be realized by a resistor of 1.3844 k. As these are not available, the actual reference current will be slightly different. This means that all derived signal currents will be scaled in the same way. 2. IC1 = IC2 = IC3 = IC4 = 10 A; ISA1 = ISA2 = ISB1 = ISB2 = 1.25 A; Inegain = 50 A; Isdfine = 20 A; IRREF = -900 A; Icagain = 35 A; ERON = 1. 3. The voltage on TLN can be clamped with respect to GND (positive and negative) with one or two diodes. The clamp has an internal resistance of approximately 900 . 4. In the TZA1020A, pin MIRN is clamped with respect to GND (positive) by means of one diode. 5. IC1 = IC2 = IC3 = IC4 = 25 A; ISA1 = ISA2 = ISB1 = ISB2 = 3.125 A; Isdfine = 20 A; IRREF = -900 A. 6. 4 x G gr x ( I ref + I sdfine ) V RE = - T rre x ( I C1 + I C4 ) - ( I C2 + I C3 ) - ----------------------------------------------------------- x ( ( I SA1 + I SB1 ) - ( I SA2 + I SB2 ) ) I ref
7. IC1 = IC2 = IC3 = IC4 = 25 A; ISA1 = ISA2 = ISB1 = ISB2 = 3.125 A. 8. Ci = total capacitance connected to all input pins C1 to C4 (between pin and ground). 9. IC1 = 2e-3.(1 + 0.7 sin(12.3e6.t)) A; ISA1 = ISB1 = ISA2 = ISB2 = 25 A; IMIRN = 15 A; Ialphagain = 50 A; Isumref = 15 A; IAZIN = 100 A; AMON = 1; alphactrl(2 to 0) = 000; algctr4 = 00; algctr6 = 1; algctr5 = 0; ICAGAIN = 200 A. 10. IC1 = IC2 = IC3 = IC4 = 25 A; Ippnscl = 50 A; ppnctrl1 = 1, ppnctrl2 = 1. Sr loop x k bal 11. Bandwidth = ------------------------------- . 2 12. Iop and Ion are limited to 12 A 3 A. L-R 13. V PPN = ------------- x R ( I - V ) x I ppnscl L + R
2000 Oct 30
25
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
Table 28 Fast track count; note 1 FTC CURRENTS Isd-fine CONTROL SIGNAL sdfine7 to sdfine0
TZA1020; TZA1020A
BINARY VALUE CONTROL SIGNAL 0000000 : 0111111 : 1111111
VALUE CURRENT (A) 0.12 : 15 : 30 20
Iref Note
-
-
1. The currents are proportional to IRREF. The given current values are valid at IRREF = -900 A. Table 29 Spot position measurements meassel CODE 00 (POR) 01 10 11 IMEAS1 Gcd [(IC1 + IC4) - (IC2 + IC3)] Gsd (ISA1 - ISA2) Gsd (ISA1 + ISB1) Gsd (ISA1 + ISA2) IMEAS2 Gcd [(IC1 + IC2) - (IC3 + IC4)] Gsd (ISB2 - ISB1) Gsd (ISA2 + ISB2) Gsd (ISB1 + ISB2)
Table 30 Laser power calibration (beta circuit); note 1 BETA CIRCUIT CURRENTS Ibetascl CONTROL SIGNAL betascl4 to betascl0 BINARY VALUE CONTROL SIGNAL 00000 : 01111 : 11111 Note 1. The currents are proportional to IRREF. The given current values are valid IRREF = -900 A. VALUE CURRENT (A) 3.125 : 50 : 100
2000 Oct 30
26
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
TZA1020; TZA1020A
k, full pagewidth
MGR812
I CI
Ip1
lp2 Icalfi
V beta V A1 = ----------------- x I p1 I betascl V beta V A2 = ----------------- x I p2 I betascl V beta V CALF = ----------------- x I calfi I betascl I C1 = I C1 + I C2 + I C3 + I C4 I p1 = ( I C1 I calfi ) I p2 = ( I calfi I C1 )
Fig.5 Laser power calibration signal (beta circuit).
2000 Oct 30
27
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
11.1 Transfer functions for normalized servo signals
TZA1020; TZA1020A
I C1 - I C4 I C3 - I C2 I FEN = G fe x --------------------- + --------------------- x I negdoc I C1 + I C4 I C3 + I C2 ( I C1 + I C4 ) - ( I C2 + I C3 ) - G sat x ( I S1 - I S2 ) I XDN = G xd x ------------------------------------------------------------------------------------------------------------- x I negdoc I C1 + I C2 + I C3 + I C4 + G sat x ( I S1 + I S2 ) - ( I C1 + I C4 ) - ( I C2 + I C3 ) - G sat x ( I S1 - I S2 ) I REN = G re x RE scale x ------------------------------------------------------------------------------------------------------------- x I negdoc I C1 + I C2 + I C3 + I C4 + G sat x ( I S1 + I S2 ) - ( I C1 + I C4 ) - ( I C2 + I C3 ) - G sat x ( I S1 - I S2 ) I TLN = G tl x TL scale x ------------------------------------------------------------------------------------------------------------- x I negdoc I C1 + I C2 + I C3 + I C4 + G sat x ( I S1 + I S2 ) - ( I C1 + I C4 ) - ( I C2 + I C3 ) - G sat x ( I S1 - I S2 ) I MIRN = - G mir x MIR scale x ------------------------------------------------------------------------------------------------------------- x I negain - I CAGAIN I C1 + I C2 + I C3 + I C4 I negdoc = I negain x -------------------------------------------------- - I sumref I C1 + I C2 + I C3 + I C4 I negdoc = I negain x -------------------------------------------------- - I sumref I C1 + I C2 + I C3 + I C4 I negdoc = I negain x -------------------------------------------------- - I sumref I S1 = I SA1 + I SB1, I S2 = I SA2 + I SB2 4 x G gr x ( I ref + I sdfine ) G sat = ----------------------------------------------------------I ref at I C1 + I C2 + I C3 + I C4 < 0.9I sumref
at I C1 + I C2 + I C3 + I C4 > 1.1I sumref
at I C1 + I C2 + I C3 + I C4 > 1.1I sumref
2000 Oct 30
28
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
11.2 Laser power control signals (alpha circuit)
TZA1020; TZA1020A
The alpha circuit can be split into an alpha circuit for CD-RW, an alpha circuit for CD-R and a subtractor with additional gain switching. The alpha circuit is active only if AMON = 1. Table 31 Alpha scale factors SCALE FACTOR gain input current CONTROL SIGNAL alphactrl2 to alphactrl0 BINARY VALUE CONTROL SIGNAL 000 001 010 011 100 101 110 111 current gain output algctrl4 and Algctrl6 00 01 10 11 subtractor gain algctrl1 and algctrl0 00 01 10 11 Table 32 Alpha currents; note 1 ALPHA CIRCUIT CURRENTS Ialphagain CONTROL SIGNAL alphagain4 to alphagain0 BINARY VALUE CONTROL SIGNAL 00000 01111 11111 Iref Note 1. The currents and gain factor are proportional to IRREF. The given current values are valid at IRREF = -900 A. - - VALUE CURRENT (A) 3.125 50 100 20 VALUE SCALE FACTOR 0.50 0.33 0.25 0.20 0.17 0.14 0.12 0.11 0 1 3 4 0.25 0.5 0.75 1.0
2000 Oct 30
29
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
11.3 Wobble pre-processor
TZA1020; TZA1020A
Table 33 Wobble currents; note 1 WOBBLE CURRENTS Ippnscl CONTROL SIGNAL ppnscl4 to ppnscl0 BINARY VALUE CONTROL SIGNAL 00000 : 01111 : 11111 Note 1. The currents are proportional to IRREF. The given current values are valid at IRREF = -900 A. VALUE CURRENT (A) 3.125 : 50 : 100
2000 Oct 30
30
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
12 APPLICATION AND TEST INFORMATION
TZA1020; TZA1020A
handbook, full pagewidth
ERON 15 from laser control +12 V 35 FEN CAGAIN 11 INPUT STAGE 3 LPF 1 DIODE INPUT STAGE 1 LPF 2 WOBBLE PREPROCESSOR NORMALIZER 36 REN 37 TLN 34 XDN 38 MIRN SERVO
SA1 4 SA2 8 SB1 5 SB2 9 C1 10 C2 3 C3 6 C4 7 DIODE INPUT STAGE 2
26 PPN 27 CWBL WOBBLE DEMODULATOR 100 nF 24 DALPHA 22 AINT 1 nF 70 pF 25 AZIN from microcontroller to laser
AMON 14 TIMING CIRCUIT ASTROBE 19 AINTON 20 ALS 21
ALPHA DETECTOR
TZA1020 TZA1020A
control switches
control currents
CURRENT AMPLIFIER
23 CAHF
EFM DECODER
44 CALF REGISTER 43 A1 42 A2 BETA DETECTOR BETA MEASUREMENT
SDA 12 from microcontroller SCL 13 I2C-BUS INTERFACE DACs to laser control UOUT 1 DRIVER POR
39 CALPF 40 HCA1 41 HCA2 10 nF 32 MEAS1 -5 V 10 nF -5 V 15 nF -5 V
MEAS BAND GAP REFERENCE
33 MEAS2
RREF 2
FAST TRACK COUNT 17 16
31 RE
(optional)
-5 V
30
29
28
18
VSS1 GND1 VDD1 100 nF 100 nF
VSS2 GND2 VDD2 100 nF 100 nF
MGR813
-5 V
+5 V
-5 V
+5 V
Fig.6 Application diagram.
2000 Oct 30
31
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
13 PACKAGE OUTLINE
TZA1020; TZA1020A
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
2000 Oct 30
32
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
14 SOLDERING 14.1 Introduction to soldering surface mount packages
TZA1020; TZA1020A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. 14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 Oct 30
33
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
14.5
TZA1020; TZA1020A
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE REFLOW(1) suitable suitable suitable suitable suitable
BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes
not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Oct 30
34
Philips Semiconductors
Product specification
Pre-amplifiers for CD-RW systems
15 DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development
TZA1020; TZA1020A
DEFINITIONS (1) This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. 16 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 PURCHASE OF PHILIPS I2C COMPONENTS 17 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2000 Oct 30
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Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp36
Date of release: 2000
Oct 30
Document order number:
9397 750 04694

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